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> Kester RF741 tacky solder rework flux paste 30G syringe
Kester RF741 tacky solder rework flux paste 30G syringe
Kester RF741 No-Clean Electronic Grade Rework Flux - 30Gram Syringe
Designed for BGA and QFP repair. Perfect for use when reflowing the GPU during Xbox 360 "Ring Of Death" Repairs
This is a 30 Gram syringe with piston for use with air-powered dispenser
RF741 is a high-viscosity No-Clean paste flux developed to assist in printed circuit board rework or repair. RF741 is an effective paste flux for prototype work where a small amount of flux is needed on a specific area of a board or assembly. After being dispensed, rework flux stays in place until soldering occurs. Exhibits excellent performance in applications requiring a flux having good thermal stability such as surface mount component or repair.
It is the ideal choice for QFP or BGA rework operations. It is also well suited for use with through-hole repair operations.
Residues that remain after soldering are almost colorless, leaving a cosmetically appealing repair. The residue has high electrical resistance is safe to be left on the assembly after soldering.
* High Viscosity- stays where you put it.
* Residues are non-corrosive, so not need to be removed after soldering
* Compatible with most no-clean solders and fluxes.
* Leaves bright/shiny solder joints after reflow
* Lead Free - RoHS compliant.
* May be used with leaded or lead-free solders.
* Stored in a controlled environment
