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> Loctite hysol US2651 potting encapsulation compound
Loctite hysol US2651 potting encapsulation compound
Potting and Encapsulation Compound
HYSOL US2651 is an unfilled, low viscosity, reenterable
potting and encapsulation compound. It can be used to
encapsulate electronics for automotive applications including
under-the-hood. The low glass transition temperature means
that sensitive components are not damaged during low
