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Mcc-epxw expoxy wipes remove solder paste, smt adhesive
MCC-EPXW ExPoxy Remover Presaturated Wipes for Removing SMT Adhesives and Solder Pastes
A Versatile Choice for Understencil and Manual Cleaning of Solder Pastes, Adhesives & Inks
The Strongest Cleaner/Degreaser In It s Class
Great on Lead-Free Pastes, Chip Bonder and Some Inks
Proven Effective in Stencil Printer Wetting Systems
MicroCare s ExPoxy Remover has been an instant success since it was introduced more than a decade ago. Powerful and easy-to-use, it is the leading choice for your most difficult stencil cleaning applications.
ExPoxy Remover is an innovative stencil cleaner and degreaser. It is a strong product that easily cleans all solder pastes from stencils, misprinted boards and electronic assemblies. Blended from aliphatic hydrocarbons, it offers process engineers great flexibility because it also works well on uncured and partially cured chip bonder, plus grease, light oils and even some inks. This cleaner easily dissolves both organic and inorganic (ionic) deposits, and some acrylic conformal coatings. It can be used safely on all types of circuits and mechanical parts - even working as a light degreaser. Engineers and operators select the ExPoxy Remover because it is convenient, powerful, easy to use and environmentally benign. In short, ExPoxy Remover is a great choice for precision cleaning.
Chemical Family: Aliphatic HydroCarbon
Appearance: Clear, Colorless Liquid
Boiling Point: 120 - 150 C / 248 - 302 F
Cleaning Strength (Kb): 90
Specific Gravity (@ 25 C): 0.89
Surface Tension (dynes/cm): 24.9
Health, Safety & Environmental Data:
Flashpoint (TCC): 41 C / 106 F
Safety Rating: Combustible
NFPA: Health: 0 Fire: 2 Reactivity: 0
See MSDS for more safety and toxicity data
ExPoxy Remover is certified as
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